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revisions ltr description date (yr-mo-da) approved a added arrhenius equation for unbiased bake under margin test method a, back end margin test step c. corrected military part numbers for device types 01 and 02. technical changes made to 1.2.2, table i, figure 1, figure 2, figure 4, figure 5, 4.3.1, and table ii. added vendor cage 34649 for device type 05. editorial changes throughout. 89-01-19 m. a. frye b add device type 08 for vendor cage number 66579. add vendor cage number 34335 to the drawing as a source of supply for the 08 device with changes to table i. deleted programming cycle timing waveform and table iii from drawing. also deleted esds from drawing. editorial changes throughout. 89-10-30 m. a. frye c deleted vendor cage number 34335 as a source of supply for device type 08. added vendor cage number 34335 as a source of supply for device types 01 through 07. delet ed figure 5. editorial changes throughout. 90-02-26 m. a. frye d changes in accordance with nor 5962-r079-95. 95-02-15 m. a. frye e added provisions for qd certificati on. added cage 0c7v7 to drawing as a source of supply for device type 07. updated boilerplate. - glg 99-12-03 raymond monnin f boilerplate update, part of 5 year review. ksr 06-09-29 raymond monnin g corrected footnote 1 / on section 1.2.2 package style heading to include all packages. corrected test met hod number in 4.3.2 b (1). ksr 09-03-30 robert m. heber the original first page of this drawing has been replaced. rev sheet rev sheet rev status rev g g g g g g g g g g g of sheets sheet 1 2 3 4 5 6 7 8 9 10 11 pmic n/a prepared by rick c. officer defense supply center columbus standard microcircuit drawing checked by d. a. dicenzo columbus, ohio 43218-3990 http://www.d scc.dla.mil this drawing is available for use by all departments approved by robert p. evans and agencies of the department of defense drawing approval date 87-10-23 microcircuit, memory, digital, cmos, 16k x 8-bit ultra violet erasable programmable read only memory (uveprom), monolithic silicon amsc n/a revision level g size a cage code 67268 5962-87661 sheet 1 of 11 dscc form 2233 apr 97 5962-e233-09 .
standard microcircuit drawing size a 5962-87661 defense supply center columbus columbus, ohio 43218-3990 revision level g sheet 2 dscc form 2234 apr 97 1. scope 1.1 scope . this drawing describes device requirements for mil- std-883 compliant, non-jan class level b microcircuits in accordance with mil-prf-38535, appendix a. 1.2 part or identifying number (pin) . the complete pin is as shown in the following example: 5962-87661 01 x a drawing number device type (see 1.2.1) case outline (see 1.2.2) lead finish (see 1.2.3) 1.2.1 device type(s) . the device type(s) identify the circuit function as follows: device type generic number 1 / circuit function access time 01 27c128 16k x 8-bit uveprom 90 ns 02 27c128 16k x 8-bit uveprom 120 ns 03 27c128 16k x 8-bit uveprom 150 ns 04 27c128 16k x 8-bit uveprom 170 ns 05 27c128 16k x 8-bit uveprom 200 ns 06 27c128 16k x 8-bit uveprom 250 ns 07 27c128 16k x 8-bit uveprom 300 ns 08 27c128 16k x 8-bit uveprom 70 ns 1.2.2 case outline(s) . the case outline(s) are as des ignated in mil-std-1835 and as follows: outline letter descriptive designator terminals package style 1 / x gdip1-t28 or cdip2-t28 28 dual-in-line package y cqcc1-n32 32 rect angular leadless chip carrier 1.2.3 lead finish . the lead finish is as spec ified in mil-prf-38535, appendix a. 1.3 absolute maximum ratings . 2 / supply voltage range (v cc ) 2 / ..................................................... -0.6 v dc to 6.25 v dc supply voltage range (v pp ) 2 / ..................................................... -0.6 v dc to 14.0 v dc all input voltage range except a 9 2 / .......................................... -0.6 v dc to 6.25 v dc input voltage range (a 9 ) 2 / .......................................................... -0.6 v dc to 13.5 v dc output voltage range 2 / .............................................................. -0.6 v dc to v cc + 1.0 v dc storage temperatur e range ........................................................ -65 ? c to +150 ? c power dissipati on ........................................................................ 300 mw lead temperature (solderi ng, 10 seconds ) .................................. +300 ? c thermal resistance, junction-to-case ( jc ) ................................... see mil-std-1835 junction temperature (t j ) .......................................................... +150 ? c 3 / data retenti on ............................................................................ 10 years minimum 1.4 recommended operating conditions . supply voltage range (v cc ) 4 / .................................................... 4.5 v dc to 5.5 v dc supply voltage range (v pp ) 5 / ..................................................... 4.5 v dc to 5.5 v dc high level input voltage range (v ih ).............................................. 2.0 v dc to 6.5 v dc (ttl) high level input voltage range (v ih ).............................................. v cc -0.2 v dc to v cc +0.2 v dc (cmos) low level input voltage range (v il ) ............................................. -0.1 v dc to 0.8 v dc (ttl) low level input voltage range (v il ) ............................................. gnd -0.2 to gnd +0.2 v dc (cmos) case operating temperature range (t c ) ...................................... -55 ? c to +125 ? c 1 / lid shall be transparent to permit ultraviolet light erasure. 2 / under absolute maximum ratings, voltages are with respect to gnd. 3 / maximum junction temperature may be increased to +175 ? c during burn-in and steady-state life. 4 / v cc must be applied before or at the same time as v pp and removed after or at the same time as v pp . the device must not be inserted into or removed from the board when v pp or v cc is applied. 5 / v pp can be connected to v cc directly (except in the program mode). v cc supply current in this case would be i cc + i pp . during programming, v pp must be maintained at 12.5 v (0.5 v).
standard microcircuit drawing size a 5962-87661 defense supply center columbus columbus, ohio 43218-3990 revision level g sheet 3 dscc form 2234 apr 97 2. applicable documents 2.1 government specif ication, standards, and handbooks . the following specificati on, standards, and handbooks form a part of this drawing to the extent specified herein. unless otherwise specified, the issues of thes e documents are those cited in t he solicitation or contract. department of defense specification mil-prf-38535 - integrated circuits, manufacturing, general specification for. department of defense standards mil-std-883 - test me thod standard microcircuits. mil-std-1835 - interface standard electronic component case outlines. department of defense handbooks mil-hdbk-103 - list of st andard microcircuit drawings. mil-hdbk-780 - standard microcircuit drawings. (copies of these document s are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111-5094.) 2.2 order of precedence . in the event of a conflict between the text of this drawing and the refe rences cited herei n, the text of this drawing takes precedence. nothing in this documen t, however, supersedes applicable laws and regulations unless a specific exempti on has been obtained. 3. requirements 3.1 item requirements . the individual item requirements shall be in accordance with mil-prf-38535, appendix a for non- jan class level b devices and as specified herein. product built to this drawing t hat is produced by a q ualified manufacturer listing (qml) certified and qualif ied manufacturer or a manufacturer who has been granted transitional ce rtification to mil- prf-38535 may be processed as qml product in accordance wi th the manufacturers approv ed program plan and qualifying activity approval in accordance with mil-prf-38535. this qml flow as documented in the quality management (qm) plan may make modifications to the requirements herein. these modifi cations shall not affect form, fit, or function of the device. these modifications shall not affect the pi n as described herein. a "q" or "qml" ce rtification mark in accordance with mil- prf-38535 is required to identify w hen the qml flow option is used. 3.2 design, construction, and physical dimensions . the design, construction, and physica l dimensions shall be as specified in mil-prf-38535, appendix a and herein. 3.2.1 terminal connections . the terminal connections shall be as specified on figure 1. 3.2.2 truth table . the truth table shall be as specified on figure 2. 3.2.2.1 unprogrammed devices . the truth table for unprogrammed devic es shall be as specified on figure 2. 3.2.2.2 programmed devices . the requirements for supplying programmed devices are not part of this drawing. 3.2.3 case outlines . the case outlines shall be in accordance with 1.2.2 herein. 3.3 electrical performance characteristics . unless otherwise specified herein, the electrical performance characteristics are as specified in table i and shall apply over the full case operati ng temperature range. 3.4 electrical test requirements . the electrical test requirements shall be the subgroups specified in table ii. the electrical tests for each subgroup are described in table i.
standard microcircuit drawing size a 5962-87661 defense supply center columbus columbus, ohio 43218-3990 revision level g sheet 4 dscc form 2234 apr 97 table i. electrical performance characteristics . test symbol conditions device group a limits unit -55 ? c < t c < +125 ? c types subgroups 4.5 v < v cc < 5.5 v min max unless otherwise specified high level output v oh i oh = -400 a all 1,2,3 2.4 v voltage low level output v ol i ol = 2.1 ma all 1,2,3 0.45 v voltage input current i i v i = 0 v to 5.5 v all 1,2,3 10 a (leakage) output current i o v o = 0 v to v cc all 1,2,3 10 a (leakage) v pp supply current i pp1 v pp = v cc = 5.5 v all 1,2,3 100 a v pp supply current i pp2 v pp = 13 v 01-07 1 50 ma (during program pulse) 1 / 08 60 operating supply i cc1 v cc = 5.5 v, ce = v il , 03.04, 1,2,3 25 ma current (active) f = 1/t avqv , 05,06, 0 1 -0 8 = 0 ma 07 08 85 01 70 02 60 standby power supply i cc2 v cc = 5.5 v, ce = 2.0 v, 01-07 1,2,3 3.0 ma current (ttl) f = 0 08 200 standby power supply i cc3 v cc = 5.5 v, ce = v cc , 01-07 1,2,3 300 a current (cmos) f = 0 08 500 input capactiance c in v i = 0 v, f = 1 mhz, all 4 10 pf see 4.3.1c output capacitance c out v o = 0 v, f = 1 mhz, all 14 pf see 4.3.1c 4 functional tests see 4.3.1e all 7,8a,8b see footnotes at end of table.
standard microcircuit drawing size a 5962-87661 defense supply center columbus columbus, ohio 43218-3990 revision level g sheet 5 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions device group a limits unit -55 ? c < t c < +125 ? c types subgroups 4.5 v < v cc < 5.5 v min max unless otherwise specified address access time t avqv see figures 3 and 4 01 9,10,11 90 ns 2 / 02 120 03 150 04 170 05 200 06 250 07 300 08 70 chip enable access t elqv see figures 3 and 4 01 9,10,11 90 ns time 2 / 02 120 03 150 04 170 05 200 06 250 07 300 08 70 output enable access t olqv see figures 3 and 4 01,02 9,10,11 50 ns time 2 / 03,04 70 05 75 06 100 07 120 08 25 ce or oe disable to t ehqz , see figures 3 and 4 01,02 9,10,11 50 ns output in high z 1 / t ohqz 03,04 05,06 60 07 105 08 25 ce or oe enable to t ehqv , see figures 3 and 4 all 9,10,11 0 ns output valid 1 / t ohqv 1 / may not be tested, but shall be guarant eed to the limits specified in table i. 2 / for all switching characteristics and timing meas urements, inputs pulse leve ls are 0.40 v and 2.4 v and v pp = 12.5 v0.5 v during programming.
standard microcircuit drawing size a 5962-87661 defense supply center columbus columbus, ohio 43218-3990 revision level g sheet 6 dscc form 2234 apr 97 device types all case outlines x y terminal number terminal symbol 1 v pp nc 2 a 12 v pp 3 a 7 a 12 4 a 6 a 7 5 a 5 a 6 6 a 4 a 5 7 a 3 a 4 8 a 2 a 3 9 a 1 a 2 10 a 0 a 1 11 o 1 a 0 12 o 2 nc 13 o 3 o 1 14 gnd o 2 15 o 4 o 3 16 o 5 gnd 17 o 6 nc 18 o 7 o 4 19 o 8 o 5 20 ce o 6 21 a 10 o 7 22 oe o 8 23 a 11 ce 24 a 9 a 10 25 a 8 oe 26 a 13 nc 27 pgm a 11 28 v cc a 9 29 --- a 8 30 --- a 13 31 --- pgm 32 --- v cc nc = no connection figure 1. terminal connections .
standard microcircuit drawing size a 5962-87661 defense supply center columbus columbus, ohio 43218-3990 revision level g sheet 7 dscc form 2234 apr 97 mode function pins (see note 1) ce oe pgm v pp v cc a 9 a 0 0 1 - 0 8 read v il v il v ih v cc v cc x x d out output disable v il v ih v ih v cc v cc x x high-z standby v ih x x v cc v cc x x high-z programming v il v ih v il v pp v cc x x d in verify v il v il v ih v pp v cc x x d out program v ih x x v pp v cc x x high-z inhibit signature mode v il v il v ih v cc v cc vh v il mfg code (see notes 2, 3, and 4) vh v ih device code notes: 1. x can be v il or v ih . 2. vh = 12 v0.5 v. 3. all other address must be held at v il . 4. see 6.6. figure 2. truth table .
standard microcircuit drawing size a 5962-87661 defense supply center columbus columbus, ohio 43218-3990 revision level g sheet 8 dscc form 2234 apr 97 figure 3. read cycle timing waveform . figure 4. output load circuit .
standard microcircuit drawing size a 5962-87661 defense supply center columbus columbus, ohio 43218-3990 revision level g sheet 9 dscc form 2234 apr 97 3.5 marking . marking shall be in accordance with mil-prf-38535, appendix a. the part shall be marked with the pin listed in 1.2 herein. in addition, the manufactu rer's pin may also be marked. for pack ages where marking of the entire smd pin number is not feasible due to space limit ations, the manufacturer has the option of not marki ng the "5962-" on the device. 3.5.1 certificat ion/compliance mark . a compliance indicator ?c? shall be marked on all non-jan devices built in compliance to mil-prf-38535, appendix a. the compliance indicator ?c? sha ll be replaced with a "q" or "q ml" certification mark in accordance with mil-prf-38535 to identif y when the qml flow option is used. 3.6 processing eproms . all testing requirements and quality assurance provisions herein sha ll be specified by the manufacturer prior to delivery. 3.6.1 erasure of eproms . when specified, devices shall be erased in a ccordance with the procedures and characteristics specified in 4.4. 3.6.2 programmability of eproms . when specified, devices shall be progra mmed to the specified pattern using the procedures and characterist ics specified in 4.5. 3.6.3 verification of erasur e or programmability of eproms . when specified, devices shall be verified as either programmed to the specified program or erased. as a minimum, verification shall consist of performing a functional test (subgroup 7) to v erify that all bits are in the proper state. any bit that does not verify to be in the proper state shall constitute a failure, and shall be removed from the lot. 3.7 certificate of compliance . a certificate of compliance shall be required from a manufactu rer in order to be listed as an approved source of supply in mil-hdbk-103 (s ee 6.6 herein). the certificate of co mpliance submitted to dscc-va prior to listing as an approved source of supply sha ll affirm that the manufacturer's product meets the requirement s of mil-prf-38535, appendix a and the requirements herein. 3.8 certificate of conformance . a certificate of conformance as requi red in mil-prf-38535, appendix a shall be provided with each lot of microcircuits delivered to this drawing. 3.9 notification of change . notification of change to dscc-va shall be requi red for any change that affects this drawing. 3.10 verification and review . dscc, dscc's agent, and the acquiring activity re tain the option to review the manufacturer's facility and applicable required doc umentation. offshore documentat ion shall be made available ons hore at the option of the reviewer. 3.11 data retention . a data retention stress test shall be completed as part of the vendor's re liability monitors. this test shall be done initially and after any design or process change which may affect data retention. t he methods and procedures may be vendor specific, but will guarantee the number of years listed in section 1.3 herein over the fu ll military tem perature range. the vendor's procedure shall be kept under document control and sha ll be made available upon request. 4. verification 4.1 sampling and inspection . sampling and inspection procedures shall be in accordance with mil-prf-38535, appendix a. 4.2 screening . screening shall be in accordance with method 5004 of mil-std-883, and shall be conducted on all devices prior to quality conformance inspection. the following additional criteria shall apply: a. burn-in test, method 1015 of mil-std-883. (1) test condition a, b, c, or d. the test circuit sha ll be maintained by the manufacturer under document revision level control and shall be made available to t he preparing activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissi pation, as applicable, in accordance with the intent specified in method 1015 of mil- std-883. (2) t a = +125 ? c, minimum. b. interim and final electrical test parameters shall be as s pecified in table ii herein, exc ept interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer.
standard microcircuit drawing size a 5962-87661 defense supply center columbus columbus, ohio 43218-3990 revision level g sheet 10 dscc form 2234 apr 97 4.3 quality conf ormance inspection . quality conformance inspection shall be in accordance with method 5005 of mil-std- 883 including groups a, b, c, and d inspections. the following additional criteria shall apply. 4.3.1 group a inspection . a. tests shall be as spec ified in table ii herein. b. subgroups 5 and 6 in table i, method 5005 of mil-std-883 s hall be omitted. c. subgroup 4 (c in and c out measurement) shall be measured only for the initial test and after process or design changes which may affect capacitance. sample size is fifteen dev ices with no failures and all input and output terminals tested. d. all devices selected for testing shall have a checkerboard pattern or equivalent. after completion of all testing, the devices shall be verified and erased (except dev ices submitted for groups c and d testing). e. subgroups 7, 8a, and 8b shall incl ude verification of the truth table. table ii. electrical test requirements . 1 / 2 / 3 / mil-std-883 test requirements subgroups (in accordance with method 5005, table i) interim electrical parameters (method 5004) --- final electrical test parameters (method 5004) 1*, 2, 3, 7, 8a, 8b, 9, 10, 11 group a test requirements (method 5005) 1, 2, 3, 4**, 7, 8a, 8b, 9, 10, 11 groups c and d end-point electrical parameters (method 5005) 2, 8a, 10 or 1, 2, 3 1 / * indicates pda applies to subgroups 1. 2 / any or all subgroups may be comb ined when using high-speed testers. 3 / ** see 4.3.1c. 4.3.2 groups c and d inspections . a. end-point electrical parameters shall be as spec ified in table ii herein. b. steady-state life test condi tions, method 1005 of mil-std-883. (1) test condition a, b, c, or d. the test circuit sha ll be maintained by the manufacturer under document revision level control and shall be made available to t he preparing activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissi pation, as applicable, in accordance with the intent specified in method 1005 of mil- std-883. (2) t a = +125 ? c, minimum. (3) test duration: 1,000 hour s, except as permitted by method 1005 of mil-std-883. c. all devices selected for testing shall be programm ed with a checkerboard pattern, then verified and erased. 4.4 erasing procedures . the recommended erasing procedure shall be as s pecified by the device manufacturer and shall be made available upon request. 4.5 programming procedures . the programming procedures shall be as spec ified by the device m anufacturer and shall be made available upon request.
standard microcircuit drawing size a 5962-87661 defense supply center columbus columbus, ohio 43218-3990 revision level g sheet 11 dscc form 2234 apr 97 5. packaging 5.1 packaging requirements . the requirements for packaging shall be in accordance with mil-prf-38535, appendix a. 6. notes 6.1 intended use . microcircuits conforming to this drawing are int ended for use for government microcircuit applications (original equipment), design applic ations, and logistics purposes. 6.2 replaceability . microcircuits covered by this drawing will repl ace the same generic device covered by a contractor- prepared specificati on or drawing. 6.3 configuration control of smd's . all proposed changes to existing smd's will be coordinated with the users of record for the individual documents. this c oordination will be accomplished using dd form 1692, engineering change proposal. 6.4 record of users . military and industrial users shall inform defens e supply center columbus (dscc) when a system application requires configurati on control and the applicable smd. dscc will main tain a record of users and this list will be used for coordination and distribution of c hanges to the drawings. users of drawi ngs covering microelectronics devices (fsc 5962) should contact dscc- va, telephone (614) 692-0544. 6.5 comments . comments on this drawing should be directed to dscc-va, columbus, ohio 43218-3990, or telephone (614) 692-0547. 6.6 approved sources of supply . approved sources of supply are listed in mil-hdbk-103. the vendors listed in mil- hdbk-103 have agreed to this drawing and a ce rtificate of compliance (s ee 3.6 herein) has been subm itted to and accepted by dscc-va.
standard microcircuit drawing bulletin date: 09-03-30 approved sources of supply for smd 5962-87661 are listed below for immediate acquisition information only and shall be added to mil-hdbk-103 and qml-38535 during the next re vision. mil-hdbk-103 and qml-38535 will be revised to include the addition or deletion of s ources. the vendors listed below have agr eed to this drawing and a certificate of compliance has been submitted to and a ccepted by dscc-va. this information bulletin is superseded by the next dated revision of mil-hdbk-103 and qml- 38535. dscc maintains an online databas e of all current sources of supply at http://www.d scc.dla.mil/programs/smcr/ . standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-8766101xa 3 / 3 / 0c7v7 am27c128-90/bxa ws27c128f-90dmb 27c128-90 5962-8766101ya 3 / 3 / 0c7v7 am27c128-90/bua ws27c128f-90cmb 27c128-90 5962-8766102xa 3 / 3 / 0c7v7 am27c128-120/bxa ws27c128l-12dmb 27c128-120 5962-8766102ya 3 / 3 / 0c7v7 am27c128-120/bua ws27c128l-12cmb 27c128-120 5962-8766103xa 3 / 3 / 3 / 0c7v7 am27c128-150/bxa 27c128-15bxa ws27c128l-15dmb 27c128-150 5962-8766103ya 3 / 3 / 3 / 0c7v7 am27c128-150/bua 27c128-15buc ws27c128l-15cmb 27c128-150 5962-8766104xa 3 / 3 / 3 / 0c7v7 am27c128-170/bxa 27c128-17bxa ws27c128l-17dmb 27c128-170 5962-8766104ya 3 / 3 / 3 / 0c7v7 am27c128-170/bua 27c128-17buc ws27c128l-17cmb 27c128-170 5962-8766105xa 3 / 3 / 3 / 3 / 3 / 0c7v7 smj27c128-20jm am27c128-200/bxa md27c128-20 27c128-20bxa ws27c128l-20dmb 27c128-200 5962-8766105ya 3 / 3 / 3 / 0c7v7 am27c128-200/bua 27c128-20buc ws27c128l-20cmb 27c128-200 see footnotes at end of table.
standard microcircuit drawing bulletin ? continued. standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-8766106xa 3 / 3 / 3 / 3 / 0c7v7 smj27c128-25jm am27c128-250/bxa ws27c128l-25dmb 27c128-25bxa 27c128-250 5962-8766106ya 3 / 3 / 3 / 0c7v7 am27c128-250/bua ws27c128l-25cmb 27c128-25buc 27c128-250 5962-8766107xa 3 / 3 / 3 / 3 / 0c7v7 smj27c128-30jm am27c128-300/bxa ws27c128l-30dmb 27c128-30bxa 27c128-300/bxa 5962-8766107ya 3 / 3 / 3 / 0c7v7 am27c128-300/bua ws27c128l-30cmb 27c128-30buc 27c128-300 5962-8766108xa 0c7v7 0c7v7 ws57C128FB-70dmb 27c128-70 5962-8766108ya 0c7v7 0c7v7 ws57C128FB-70cmb 27c128-70 1 / the lead finish shown for each pin representing a hermetic package is the most readily available from the manufac turer listed for that part. if the desired lead finish is not listed, contact t he vendor to determine its availability. 2 / caution: do not use this number for it em acquisition. items acquired to this number may not satisfy the performanc e requirements of this drawing. 3 / not available from an approved source. vendor cage vendor name manufacturing device number and address code code 0c7v7 qp semiconductor 01h 16h 2945 oakmead village court santa clara, ca 95051 the information contained herein is di sseminated for convenience only and the government assumes no liability whats oever for any inaccuracies in the information bulletin.

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